Additionalinformation

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

Companydescription

Company Description

Jobdescription

Job Description

Responsible for developing, optimizing and controlling plating processes to achieve high product quality, yield and manufacturing efficiency.

Key Responsibilities

• Develop and maintain process specifications, work instructions, FMEA, Control Plans, KPIV/KPOV, and troubleshooting guides.
• Support continuous improvement, cost reduction, automation, and productivity initiatives.
• Evaluate and qualify new plating equipment, chemicals, and process technologies.
• Collaborate with equipment, quality, maintenance, and production teams to implement corrective and preventive actions for quality issues and customer complaints.
• Support new package and product qualifications, process transfers, and customer requirements.

Qualifications

• Bachelor's degree in Chemical Engineering, Materials Engineering, Manufacturing Engineering or related field.
• Knowledge of electroplating, surface finishing, wet chemistry, and materials science.
• Experience with DOE, SPC, Six Sigma, PFMEA, and root-cause analysis.
• Strong analytical and troubleshooting skills.
• Experience in semiconductor assembly plating, lead frame plating, AAS machine chemical analysis or metal-finishing processes is preferred.

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